precision testing t8 fixture

PCB Assembly SMT & DIP manufacturing Capabilities:

Quantity

Prototype, Low, Medium, High Volume PCB Assembly,

Type of Assembly

SMT, Thru-hole, Cable assembly, Wire Harness

Min. IC Pitch

0.30mm

Foot Pin

SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA

Min. Chip Placement

1005

Max. PCB Size

410 x 600mm

Min. PCB Thickness

0.35mm

Maximum BGA Size

74 x 74mm

BGA Ball Pitch

1mm ~ 3mm

BGA Ball Diameter

0.4mm ~ 1mm

QFP Lead Pitch

0.38mm ~ 2.54mm

Solder Type

Water Soluble Solder, Lead-Free, Wave soldering

Components

Passive Down to 0201 size

BGA and VFBGA

Leadless Chip Carriers/CSP/QFN

Double-sided SMT Assembly

Fine Pitch to 0.8mils

BGA Repair and Reball

Part Removal and Replacement

File Format

Bill of Materials

Gerber files

Pick-N-Place file

Types of Service

Turn-key, Partial turn-key or consignment, pilot run

Component packaging

Cut Tape, Tube ,Reels, Loose Parts

Turn Time

Same day service to 15 days service

Programing

Hex file or bin file firmware.

Testing

Flying Probe Test, X-ray Inspection AOI Test

Package

Anti-static Bubble Bag & Carton

PCB assembly process

IQC for incoming materials checking----Material baking----SMT----- Semi-Products Testing & QC ---DIP parts -- IPQC--- Wave Soldering--Semi-Products Testing & QC-----Assembling-----ICT or Xray-----100% Function Testing-----Reliability Testing (burn-testing) - Package - Shipping