Low Melt Polyamide Resin Hot Melt Adhesive

Specifications

Low Melt Polyamide Resin Hot Melt Adhesive:
Excellent adhesion
laundry&dry cleaning resistance
solvent resistance

 

 

Low Melt Polyamide Resin Hot Melt Adhesive Technical Data Sheet

update: 2012.03.23

Reference Product properties		HT-8115
Appearance Form		Granule
Components		COPA(Copolyamide)
Optical Brightener Additives		Yes
Melting range    DSC  (°C)		90-100
Melt-index           (g/10min) (160°C/21.18N)		25-35
Density                      (g/cm3)		1.1
Specifications	Granule	Φ(3-4)×(5-6)mm
Bonding condition  (for reference only)	Temperature (°C)	110-130
	Press (kg/cm2)	1.5-2.0
	Time (S)	10-15
Laundry resistance	40°C	excellent
	60°C	satisfactory
Dry-cleaning resistance		excellent

 

 

The characteristic and application of COPA granule:

The melting range is within a small range, good adhesion, excellent laundry resistance, solvent resistance and instant solidifying etc. The appearance of the granule is near clear and well-proportioned. It is user - friendly and convenient.

 

Application fields: garment, reflective materials, automotive and leather industries.

 

 

 

 

Factory:

 

 

R&D:

 

Deep cold pulverization:

 

Certification:

Exhibition: