NAND Flash Memory Emmc S3 L710 I535

NAND Flash Memory Emmc S3 L710 I535

1.Product Specifications of Emmc S3 L710 I535

1.NAND MLC flash,standard interface

we own independent WAFER cutting, packaging and testing factory

which is the 1st one in South of China.

2. Error correcting code, block management ,wear leveling

command management supported.

3. Low power consumption

Parameters quick view

LFBGA 153-ball:11.5*13*1.0mm,4GB,8GB

LFBGA 169-ball:12*16*1.0mm,8GB,16GB,32GB

2.Product Pictures of Emmc S3 L710 I535

3.Application of Our Products

4.More Products for You to Choose

5. Our Factory View

Our factory has full range of product line:
- PCI-E, 2.5”SATA, 2.5”PATA, 1.8”SATA, 1.8”PATA, Half Slim, NGFF, mSATA, mSATA Mini, SATA DOM, PATA DOM, USB DOM

- Memory Card: CFast Card, CF Card;
- Embedded Chips: eMMC, eMCP;
Applicable to harsh operating temperature environments of industrial grade.

6.Trade Show

7.Certifications

Biwin has passed ISO 9001 ISO 14001 and been audited by SGS. All of our SSD products are RoHS directive-compliant and carry CE, FCC, RoHS approvals.

We offer all the models with 3 years warranty.

  8. Our Services

  Reliability Testing:

- High and Low Temperature Storage
- High and Low Temperature Operation
- High and Low Temperature Cycling
- ESD Testing 
- Vibration and Shock Testing
- Room Temperature Aging Testing
- Power Failure Testing

State-of-the-art Manufacturing:
- Quality Guaranteed Products
- Strict Quality Control Standards
- Short Lead Time
- Low Product Defect Rate
- Large production Capacity

Wafer Packaging Service:
- First 12" Wafer Packaging Factory in South China
- Include IC Design, Packaging, Testing, Assembling
- Wafer Packaging Products:TSOP 48, QFN, QFP, BGA, LGA, eMMC, UDP.

9. Our Markets

10. Welcome to Contact Us