2016 Shuttle Star Die-bonding VCSEL/PD Platform ic mounter with Micron accuracy more than ir6000 bga rework station

2016 Shuttle Star Die-bonding VCSEL/PD Platform ic mounter with Micron accuracy more than ir6000 bga rework station

M5 is a multifunctional micro assembly machine, better than 5μm 3σ alignment accuracy.

It can be integrated with Eutectic Die Bonding Module, Bonding Force Module,

Dispenser Module,UV Curing Module, Process Observing Module, Ultrasonic Bonding Module

to reach different customers’ requirement.

It is mainly used for assembly medical CT Detector, Fiber-optic communication VCSEL/PD/LENS,LD Bar,RFID and  MEMS/MOEMS Sensor field etc

Feature:

Placement Accuracy:±2.5μm 3σ

Working Area:X: 340mm,  Y:150mm,  Z:20mm

Bonding Force:0.1N~200N

Heating Temperature:25℃~400℃

Component Size: 0.1mm~40mm

Application Field:

Die-bondig for all nm size  component