Hubless Resin Diamond Dicing Blade for Semiconductor

Resin diamond dicing blade

Features: High Processing Quality For Cutting Of Hard, Brittle Material, 

Able To Precisely Control Diamond Concentration, 

To  Achieve Cutting Quality; Improved Cut Quality On Hard Materials

Application: Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, Splitter

Metal diamond dicing blade

Features: High Rigidity minimized Wavy And Slant Cutting ; Able To Control Diamond Concentration To Achieve Cutting Quality ;Excellent Rigidity And Cut Quality

Application:  Electronic Parts, Optical Devices, Semiconductor Packages, BGA, CSP

Electroformed Dicing Blade

Features: Wide Selection Of Blade Options; Proprietary Thin-Blade Technology ;Blade Thickness - 0.015 Mm To 0.3 Mm; Available For Both Dicing Saws And Slicers

Application:  Various Types Of Semiconductor Packages, Ceramics, Magnetic Materials, PCB, Silicon