Home > Products > wafer cassettes > 6 inch DIE SAW processing Wafer Metal Cassette
6 inch DIE SAW processing Wafer Metal Cassette
Negotiable
/ Unit
1 Unit(Min.Order)
- 100 Unit / Units per Month
- shenzhen
- T/T
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Product Details
Model Number: | DSF20K06-000-R0 | Size: | 215mm*212mm*146mm |
Product Description
DIE SAW processing technology is to cut and slice a complete wafer into a grain of grain, which is convenient for the next process. In the process of cutting the dicing, a carrier must be provided to carry out the storage of the cut wafer. The 6 inch DIE SAW processing wafer cassette can do this daunting task well.
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- AddressBuilding 12, Wanfeng Dayangtian Industrial Zone, Baoan District Shenzhen,Guangdong
Product Categories
wafer cassettes | slot magazine | semiconductor equipment | wafer frame |
IC tube | revolving storage product |
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