Silicone pad for heatsink silicon thermal pad for CPU GUP heat dissipation 3.0w/m.k 200*400mm

The general usages:

transistors, diodes, transistors, switching power supply, uninterruptible power supply equipment, communications equipment, computer, flat screen TV, mobile equipment, video equipment, network products, household appliances, automobile electronic heating module, motor control, semiconductor, IS MOS tube, patch, strong voltage high temperature, high power IGBT welding machine and so on.

Please contact us for testing report PDF

This product can be customized,the common thicknesses are 0.5mm 0.75mm 1.0mm 1.5mm 2.0mm 2.5mm 3.0mm,and please notice it's without adhesive,tell us if you want adhesive on one side or both sides,Thank you!

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