450*430 Mm 15W UV PCB Separator / FR4 Board Laser Depaneling Equipment ±20 μM Precision

450*430 Mm 15W UV PCB Separator / FR4 Board Laser Depaneling Equipment ±20 μM Precision

Description

PCB Separator / FR4 Board Laser PCB Depaneling Machine ±20 μM Precision

• The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.

• In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.

• The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.

• The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.

• The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.

Parameter
Technical parameters	Main body of laser	1480mm*1360mm*1412 mm
	Weight of the	1500Kg
	Power	AC220 V
	Laser	355 nm
	Laser	Optowave 10W(US)
	Material	≤1.2 mm
	Precisio	±20 μm
	Platfor	±2 μm
	Platform	±2 μm
	Working area	600*450 mm
	Maximum	3 KW
	Vibrating	CTI(US)
	Power	AC220 V
	Diameter	20±5 μm
	Ambient	20±2 ℃
	Ambient	＜60 %
	The Machine	Marble