BERGQUIST Q PAD II SIL PAD TSP Q2500

BERGQUIST SIL PAD TSP Q2500 is a composite of aluminum foil-coated on both sides with thermally and electrically conductive SIL PAD rubber. The material is designed for those applications in which maximum heat transfer is needed and electrical isolation is not required.BERGQUIST SIL PAD TSP Q2500 is the ideal thermal interface material to replace messy thermal grease compounds.

BERGQUIST QII eliminates problems associated with grease such as contamination of reflow  solder or cleaning  operations. Unlike  grease, BERGQUIST SIL PAD TSP Q2500 can be used prior to these operations.BERGQUIST  Q PAD II also eliminates dust collection which can cause possible surface shorting  or heat buildup.