BERGQUIST HI-FLOW THF 700UT is designed as a pressure-sensitive thermal
interface material for use between a high performance processor and a heat sink.
BERGQUIST HI-FLOW 225-UT is a thermally conductive 55°C phase change
composite with inherent tack. The material is supplied on a polyester carrier
liner and is available with high-visibility protective tabs.
Above its phase change temperature,BERGQUIST HI-FLOW THF 700UT wetsout
the thermal interface surfaces and flows to produce the lowest thermal impedance.
The material requires pressure of the assembly to cause flow.
BERGQUIST HF225UT Typical Applications Include:
• Computers and peripherals
• High-performance computer processors
• Graphic cards
• Power modules
• Roll form with tabs, kiss-cut parts – no holes
BERGQUIST HF225UT is limited to a square or rectangular part design.
Dimensional tolerance is ± 0.020 in. (0.5 mm).