ZM-R7220A Infrared Soldering Station

ZM R7220A infrared SMD rework station is an intelligent infrared soldering station with real-time temperature monitoring, optical alignment system, rapid heating, and cooling. As an iir soldering station manufacturer, Zhuomao promises to provide high-quality infrared BGA machines. Significantly, Zhuomao's infrared soldering station price is reasonable. Plus, Seamark ZM-R7220A ir rework station is also called zhuo mao zm r6200c in the past.

Functions of R7220A Infrared Soldering Station (ZM R6200)

00 Real-time Temperature Monitoring

Real-time temperature display, with automatic curve analysis function.

01 Optical Alignment System

High-definition CCD (2m pixels) digital imaging, automatic optical zoom system, manual control and laser red-dot alignment.

02 Rapid heating and cooling

The IR preheating zone is heated by a medium wave ceramic infrared heating plate, a multi-functional movable PCB fixing bracket, and a BGA bottom support frame. Laminar integrated cooling fan.

As one of the top infrared soldering station suppliers in China, Seamark ZM is famous for its rich technical force, complete detection means, reliable product quality, and full service. If you want to know the BGA repair machine and to get a perfect infrared soldering station price for your factory, please contact Seamark ZM first.

Specification Of R7220A IR BGA Rework Station (ZM R6200C)

Difference Between A Hot Air Rework Station And An IR BGA Rework Station

The main difference between a hot air rework station and an IR BGA Rework Station is the way they heat the board. A hot air rework station uses heated air to transfer heat from the tool-to-board interface and into the solder balls, whereas an IR BGA Rework Station uses infrared light to heat up just enough of each ball so that it melts.

The next important difference is how they control temperature: Hot Air rework stations use PID temperature control, but IR BGA Rework Stations use proportional pressure modulation (PPM). PPM is more precise than PID because it can monitor changes in pressure within milliseconds. This means that when applying flux to a board or when reflowing solder balls on a board, you can rapidly respond by adjusting your PPM settings as necessary. With PID, this would take about 20 seconds per change due to slow response times in most systems.

Another key difference lies in airflow control systems; hot air has no need for specialized airflow since there's no need for cooling during reflow since all of that happens outside of the oven chamber using an external fan which blows across all areas equally regardless if they are close or far away from each other.

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