DOCBOND|Underfill DB840B

Name: DOCBOND|Underfill DB840B
Brand: Underfill
Price: Negotiable

FOB Price

Negotiable / Bag

50 Bags(Min.Order)

Supply Ability 1000 Bag / Bags per Month
Port Qingdao
Delivery Detail:7 days

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Product Details

Brand Name:	Underfill	Place of Origin:	China	Model Number:	DB840B
Type:	Underfill	Classification:	Hot Melt Adhesives	Usage:	Other, High temperature waterproof seal
Main Raw Material:	Acrylic

Product Description

DB840B

The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, which can effectively reduce the impact caused by mismatching of overall temperature expansion characteristics between the silicon chip and the substrate or external forces. Fast curing when heated. The lower viscosity characteristics allows for better underfilling; and good reworkability.

Contact Us

QINGDAO DOCBOND NEW MATERIAL CO.LTD: Contact nameKang Cheng; Phone86-0532-81700039; Address628 Jiushui East Road，Laoshan District Qingdao,Shandong