DOCBOND|Low Temperature Curing Adhesive

FOB Price:Negotiable |Get Latest Price
Min.Order Quantity:50 Bag / Bags
Supply Ability:1000 Bag / Bags per Month
Port:Qingdao
Delivery Detail:7 days

Product Details

Brand Name:	Low Temperature Curing Adhesive	Place of Origin:	China	Model Number:	DB291
Classification:	Hot Melt Adhesives	Usage:	Other, High temperature waterproof seal	Main Raw Material:	Acrylic

Product Description

DB291

This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a very short time. The product has excellent working performance and high storage stability. This product is suitable for low-temperature curing process, mainly used for bonding heat-sensitive components,suitable for memory cards, CCD/CMOS, LED backlights etc.