DOCBOND|High Thermal Conductivity Epoxy Adhesive

FOB Price:Negotiable |Get Latest Price
Min.Order Quantity:50 Bag / Bags
Supply Ability:1000 Bag / Bags per Month
Port:Qingdao
Delivery Detail:7 days

Product Details

Brand Name:	High Thermal Conductivity Epoxy Adhesive	Place of Origin:	China	Model Number:	DB118
Type:	Epoxy Adhesive	Classification:	Hot Melt Adhesives	Usage:	Other, High temperature waterproof seal
Main Raw Material:	Epoxy

Product Description

DB118

This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, characterized by rapid thermal curing, and easy to apply. Upon cure, it has high bonding strength, good thermal conductivity, low shrinkage, low moisture absorption, good insulation performance, etc., which can reduce the working temperature of the chip, extend the life of the chip