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DOCBOND|Hydrogen energy humidifier potting compound

FOB Price:Negotiable |Get Latest Price
Min.Order Quantity:20 Piece / Pieces
Supply Ability:1000 Bag / Bags per Month
Port:Huizhou
Payment Terms:T/T L/C D/P D/A Credit Card PayPal Cash Escrow Other
Delivery Detail:7 days

Product Details

Place of Origin:	China	Model Number:	DB3050	Type:	Hot Melt Adhesives
Classification:	Hot Melt Adhesives	Usage:	Construction	Main Raw Material:	Acrylic

Packaging Details

1kg

Product Description

DB3050 is a two-component, low viscosity, room temperature curing modified epoxy resin adhesive-forms suitable adhesives between many different types of materials. The product has excellent temperature resistance and high storage stability. Typical application This product is suitable for normal temperature curing process, mainly used for potting of hydrogen energy fuel cell humidifiers, bonding, and reinforcing various substrates such as LCP and metal structure.

Typical use

For fuel cell system humidifier sealing applications

Material properties before curing

Item	Component A	Component B
Chemical type	Modified epoxy resin
Appearance	pale yellow	transparent
Proportion@25℃ ASTM D1875 g/cm3	1.09-1.19	0.89-0.99
Viscosity @25℃ ASTM D2196 mpa.s	11200-16800	6.4-9.6
Storage period@-5℃ month	12

Physical properties of cured material

Item	Typical
Shear strength，ASTM D1002 MPa	≥10
HardnessA ASTM D2240	77～83
Water absorption， GBT 1034-2008 wt% Soak in room temperature distilled water for 24 hours	0.1%-0.2%
Curing Exotherm °C Temperature Gun	≦70
Operating temperature ℃	-40～120