Cold Laminating Technology New Smart Card Technology

      √ EMV Level test ongoing                                                           √ Embedded Condition : Algorithm based

     √ No Battery, No Supercapacitor with ISO standard                      √ Thin thickness : 0.8 mm after Lamination

√ Co-work with Global Credit Card                                                 √ Dual Interface fingerprint smart card

 

            Introduction to Cold laminating Card

The Cold laminating card adopts low temperature lamination technology (cold lamination technology). The internal structure of the cold laminating card is mainly composed of PCB circuit board, lithium polymer battery, IC integrated chip, and Bluetooth function module.

Function introduction: The working status of the card can be controlled through the Bluetooth connection of the mobile phone, and the security information and consumption information of the card can be grasped at any time.

   

  Operation principle

The fingerprint image is collected mainly through the Sensor, and the fingerprint algorithm chip is used for fingerprint processing and comparison. If the comparison is passed, the financial IC card or IC access control attendance recognition function can be connected to conduct normal transactions or open the door; if the comparison fails, the financial IC or IC access control card function cannot be used.